No Clean Solder Paste

Experience reliable and efficient soldering with this No Clean Tin Lead Solder Paste. This high-quality solder paste is specifically formulated with an alloy composition of 63% Tin [Sn] and 37% Lead [Pb], ensuring excellent soldering results for various applications. With its no-clean formula and strong viscosity, this solder paste offers a convenient solution for circuit boards, ICs, and other ASIC components.The “no clean” formula eliminates the need for cleaning the soldered joints, saving time and effort during the soldering process. The “no clean” formula is particularly beneficial in applications where cleaning the solder residue is either difficult or not recommended for the overall health of the unit, such as in sensitive PCB boards or densely populated circuit boards.

Key Features:
Alloy Composition: Our No Clean Solder Paste contains an alloy composition of 63% Tin [Sn] and 37% Lead [Pb]. This mixture provides reliable soldering performance and compatibility with a wide range of electronic components.

Solder Flux Content: The solder paste is formulated with a 10.5% solder flux content, ensuring effective flux activity for optimal wetting and solder joint formation.

No Clean Formula: The no-clean feature of this solder paste eliminates the need for post-solder cleaning, saving you time and effort during the soldering process.

Strong Viscosity and Bright Welding Point: The solder paste exhibits strong viscosity, allowing for precise application and placement. The resulting solder joints feature a bright and durable welding point, ensuring long-term reliability.

Product Parameters:
Total Weight: 39g [1.76 ounces]
Net Weight of Paste: 30g
Alloy Content: Tin 63% Lead 37%
Solder Flux Content: 10.5%
Model: XW-603

Ensure reliable soldering results and optimal performance with this No Clean Tin Lead Solder Paste. Whether you’re a professional technician or an at-home self miner repairing your boards, this solder paste is ideal for all soldering projects.