183°C Medium Temperature Solder Paste

This high-quality soldering solution is specifically designed for medium temperature applications, offering excellent performance and ease of use. Whether you’re working on PCBs, electronic components, hashboards, PSUs or other soldering projects, this solder paste is the perfect choice for achieving strong and durable solder joints.

Key Features:
Medium Temperature Soldering: The 183°C solder paste is formulated for medium temperature soldering applications, striking a balance between effectiveness and component compatibility. It ensures reliable soldering results without the risk of damaging sensitive components.

Enhanced Flow and Wetting: This solder paste provides excellent flow and wetting characteristics, allowing for even distribution and strong adhesion. The precise formulation promotes uniform solder joints, minimizing the risk of bridging, cold joints, or insufficient bonding.

Sn63Pb37 Composition: Composed of the Sn63Pb37 alloy, this solder paste offers a eutectic composition of 63% tin (Sn) and 37% lead (Pb). This well-known composition provides reliable soldering results and compatibility with a wide range of electronic components.

Easy Application: The solder paste is designed for hassle-free application, making it suitable for both experienced technicians and at-home repair jobs.

Additional Product Information:
Melting Point: 183°C
Flux Type: Rosin-based
Net Weight: 30g
Application: Ideal for PCBs, electronic components, and various soldering projects